BTU Pyramax半導(dǎo)體封裝爐
憑著的溫度和氣氛控制能力，BTU Pyramax半導(dǎo)體封裝爐是半導(dǎo)體封裝制造商，其優(yōu)良的性能得到業(yè)界一致認同。
該系列爐廣泛應(yīng)用于SMT回流焊、半導(dǎo)體封裝和固化等工藝，Air或N2氣氛，運行溫度400℃，無鉛工藝需要。控溫精度高±0.5℃，回流區(qū)網(wǎng)帶橫向溫度均勻性±2℃，設(shè)備長期運行可靠性高，綜合運營成本低，性價比高。
BTU’s Pyramax™ family of high-throughput thermal processing systems is widely recognized as the global standard of excellence for both printed circuit board solder reflow and for semiconductor packaging.
Pyramax™ systems provide optimized lead-free processing for the ultimate in productivity and efficiency. BTU’s exclusive closed loop convection control provides precise heating and cooling, programmable heat transfer, and reduced nitrogen consumption, adding up to the lowest Cost of Ownership in the industry.
With 6, 8, 10 and new 12-zone air or nitrogen models, 350℃ maximum temperature and a comprehensive menu of options, Pyramax™ systems are the industry’s most versatile performers and best value.
BTU’s Pyramax™ family of products is backed by its industry leading comprehensive warranty:
Lifetime on heaters and blowers;
3 years system;
1 year labor.
